Alternance - Ingénieur Technologies Electronique - F/h

Thales Group

Toulouse, France
Packaging 2.5d and 3d sip definition
Heterogeneous interconnection solutions
Electronic component assembly technologies
You will participate in launching projects to define technological demonstrators for System in Package (SIP) intended for space applications

Job Summary

  • You will participate in launching projects to define technological demonstrators for System in Package (SIP) intended for space applications.
  • The role involves defining the state of the art for heterogeneous interconnection solutions for 2.5D and 3D packaging.
  • Thales offers a strong commitment to work-life balance, an inclusive environment, and significant investment in R&D across key innovation domains.

Matching Summary

You will participate in launching projects to define technological demonstrators for System in Package (SIP) intended for space applications.

Skills & Requirements

Must-have

  • Packaging 2.5D and 3D SIP definition
  • Heterogeneous interconnection solutions
  • Electronic component assembly technologies
  • PCB substrate knowledge
  • Technical English proficiency

Nice-to-have

  • Material characterization methods
  • Analytical mindset and rigor
  • Curiosity for innovative solutions
  • Teamwork in diverse environments

Key Requirements

  • Engineering School degree with specialization in Electronics or Microelectronics
  • 3-year internship duration availability
  • Knowledge of electronic packaging and substrates

Work Rights

Not specified

Tailored Resume

Cover Letter