The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews
Job Summary
The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.
The role involves monitoring emerging technologies and leading R&D or continuous-improvement initiatives to shape future generations of imaging packages.
Teledyne e2v offers the opportunity to work on cutting-edge technological projects, evolve within a human-scale site, and build your career through multiple development paths within the Teledyne group.
Matching Summary
The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.
Skills & Requirements
Must-have
Microelectronics packaging design flow
Package layout and routing
Technical interface with vendors
Electrical and thermal simulations
DRC checks and design reviews
Nice-to-have
Customer focused and team player
Adaptability and communication skills
Autonomy and continuous improvement
Innovation and R&D leadership
Key Requirements
First confirmed experience in packaging design
Mastering packaging layout under Cadence APD or equivalent
Knowledge of basic mechanical design (Solidworks or equivalent)