Staff Engineer, Package Development & Engineering

Micron

Multiple Locations
Hybrid
8+ years in semiconductor packaging
Cross-functional engineering leadership
Advanced packaging flows expertise
Micron aims to transform how the world uses information to enrich life for all

Job Summary

  • Micron aims to transform how the world uses information to enrich life for all.
  • The PDE Pillar Lead will provide technical leadership for advanced packaging initiatives.
  • This role is accountable for driving technology enablement and yield acceleration.

Matching Summary

Micron aims to transform how the world uses information to enrich life for all.

Skills & Requirements

Must-have

  • 8+ years in semiconductor packaging
  • Cross-functional engineering leadership
  • Advanced packaging flows expertise

Nice-to-have

  • Familiarity with Micron's frameworks
  • Simulation modeling expertise
  • Strong technical communication skills

Key Requirements

  • Bachelor's or Master's degree in Engineering
  • 8+ years of experience in technology development
  • Deep understanding of hybrid bonding and chiplet integration

Work Rights

Not specified

Tailored Resume

Cover Letter