Application Engineer I – Silicon Package Board

Cadence Design Systems

Belo Horizonte, Minas Gerais, Brazil
Not specified; not specified; competitive benefits
Full-time onsite
Bachelor's degree in electrical or electronics engineering
Strong written and verbal communication skills
Ability to understand schematic and layout designs
Cadence Design Systems is seeking a full-time Application Engineer I for their Silicon Package Board team in Belo Horizonte, Brazil. The role focuses on printed circuit board (PCB) solutions, requiring a strong problem-solver with a background in engineering and an eagerness to learn new technologies

Job Summary

  • The role involves helping customers adopt and proliferate Cadence's packaging solutions through technical presentations and training.
  • Candidates will be trained on the Cadence Allegro tool set to work with state-of-the-art complex PCB designs.
  • The position offers a fast-paced, innovative environment where engineers can develop creative technical solutions alongside R&D teams.

Matching Summary

Match Score: 85

Cadence Design Systems is seeking a full-time Application Engineer I for their Silicon Package Board team in Belo Horizonte, Brazil. The role focuses on printed circuit board (PCB) solutions, requiring a strong problem-solver with a background in engineering and an eagerness to learn new technologies.

Salary

Not specified; Not specified; Competitive benefits

Skills & Requirements

Must-have

  • Bachelor's degree in Electrical or Electronics Engineering
  • Strong written and verbal communication skills
  • Ability to understand schematic and layout designs

Nice-to-have

  • Interest in learning new technologies
  • Self-motivated with strong problem-solving skills
  • Knowledge of competitive EDA technologies

Key Requirements

  • Complete Bachelors in Electrical, Electronics, System Engineering, Computer Science or related areas

Work Rights

Not specified

Tailored Resume

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