Senior Engineer I -process

Microchip

Mphil 3, Philippines
Wafer dicing/singulation process
Process stability (spc)
Equipment capability optimization
Microchip Technology Inc. offers a unique opportunity to be part of a global organization that powers the world

Job Summary

  • Microchip Technology Inc. offers a unique opportunity to be part of a global organization that powers the world.
  • The role involves owning the wafer dicing process to meet yield, quality, cost, and output targets.
  • Employees are supported in their growth and stability through nationally-recognized Leadership Passage Programs.

Matching Summary

Microchip Technology Inc. offers a unique opportunity to be part of a global organization that powers the world.

Skills & Requirements

Must-have

  • wafer dicing/singulation process
  • process stability (SPC)
  • equipment capability optimization

Nice-to-have

  • strong analytical skills
  • team-oriented environment
  • leadership and mentoring capability

Key Requirements

  • Minimum of 5 years experience
  • Understanding of wafer saw/dicing equipment operations
  • Working knowledge of SPC, MSA/GR&R, DOE

Work Rights

Not specified

Tailored Resume

Cover Letter