Detector Test Wire Bonding Technician

Teledyne Technologies Incorporated

Base: $44,500.00-$59,300.00; bonus/equity: not spe...
Not specified
Manual wire bonder operation
Visual inspection under microscope
Cleanroom manufacturing experience
Teledyne Technologies is seeking a Detector Test Wire Bonding Technician to join their mission-focused team, primarily working with infrared sensors for clients like NASA and the US Department of Defense. The candidate should have hands-on experience in a manufacturing or cleanroom environment, with a strong emphasis on quality and precision

Job Summary

  • Join Teledyne Imaging Sensors as a mission-focused team providing infrared sensors for space, defense, and environmental monitoring.
  • The role involves executing detector test chip mounting and wire bonding while performing visual inspections under microscopes to ensure quality.
  • Candidates receive a competitive salary, comprehensive health benefits from day one, and opportunities for educational tuition reimbursement.

Matching Summary

Match Score: 85

Teledyne Technologies is seeking a Detector Test Wire Bonding Technician to join their mission-focused team, primarily working with infrared sensors for clients like NASA and the US Department of Defense. The candidate should have hands-on experience in a manufacturing or cleanroom environment, with a strong emphasis on quality and precision.

Salary

Base: $44,500.00-$59,300.00; Bonus/Equity: Not specified; Benefits: Health, Dental, Vision, Life Insurance, 401(k) match, Stock Purchase Plan

Skills & Requirements

Must-have

  • Manual wire bonder operation
  • Visual inspection under microscope
  • Cleanroom manufacturing experience
  • Semiconductor or microelectronics background
  • Following detailed work instructions

Nice-to-have

  • Collaborative team-oriented mindset
  • Willingness to crosstrain on testing
  • Strong communication skills
  • Experience with cryogenic dewar loading

Key Requirements

  • HS Diploma with 5 years of experience OR Associate's degree with 3 years
  • US citizenship required due to access restrictions
  • Hands-on experience in semiconductor or microelectronics manufacturing

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter