Job Summary

• The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly, driving Intel's advanced packaging strategy.
• Responsibilities include owning 300mm toolsets for thick metal/via layers, bumping, reflow, thinning, and backside metallization, with a focus on safety, tool health, process control, and excursion management.
• We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and comprehensive benefit programs.

Matching Summary

Salary

Base: $120,860.00-231,670.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Key Requirements

• Bachelor's Degree in STEM field
• 6+ years semiconductor Engineering experience
• Advanced degree or 10+ years experience (preferred)
• Knowledge of statistics and experimental design (preferred)
• Strong data analysis and presentation acumen (preferred)
• Strong technical and troubleshooting skills (preferred)
• Ability to work across organizational boundaries (preferred)

Work Rights