Advanced Packaging Td - Principal Engineer, Process Integration

Micron

Taichung, Taiwan
Dram process knowledge
Hbm process knowledge
Model based problem solving
Micron Technology is a world leader in innovating memory and storage solutions

Job Summary

  • Micron Technology is a world leader in innovating memory and storage solutions.
  • The role requires leading cross-site projects to meet HBM technology milestones.
  • Candidates are encouraged to use AI tools to enhance their application materials.

Matching Summary

Micron Technology is a world leader in innovating memory and storage solutions.

Skills & Requirements

Must-have

  • DRAM process knowledge
  • HBM process knowledge
  • Model based problem solving
  • Inline defect data mining
  • Reliability test flow knowledge

Nice-to-have

  • Cross-site project leadership
  • Experience with electrical yield
  • Familiarity with packaging layout design

Key Requirements

  • Experience with DRAM/PKG test structure
  • Proficiency in JMP and SPC software
  • Knowledge of fail mechanisms

Work Rights

Not specified

Tailored Resume

Cover Letter