Technology Development Engineer (Advanced Packaging)

UNITED MICROELECTRONICS CORPORATION (Singapore Branch)

Pasir Ris, Singapore
**
2.5d/3d packaging platform technologies
Bump underfill molding rdl processes
Osat partner collaboration
** United Microelectronics Corporation (Singapore Branch) seeks a Technology Development Engineer specializing in Advanced Packaging to collaborate with external OSAT partners on advanced packaging technologies. The role requires expertise in 2.5D/3D packaging platforms and relevant processes, with a focus on ensuring quality and timely delivery. **

Job Summary

  • This role focuses on driving advanced packaging technologies with external OSAT partners to ensure high-quality and cost-effective product delivery.
  • The engineer will develop critical bump, underfill, molding, and RDL processes while collaborating with internal R&D teams.
  • Candidates must possess strong problem-solving skills using FMEA, control plans, and Design of Experiments (DOE) methodologies.

Matching Summary

Match Score: 75

** United Microelectronics Corporation (Singapore Branch) seeks a Technology Development Engineer specializing in Advanced Packaging to collaborate with external OSAT partners on advanced packaging technologies. The role requires expertise in 2.5D/3D packaging platforms and relevant processes, with a focus on ensuring quality and timely delivery. **

Skills & Requirements

Must-have

  • 2.5D/3D packaging platform technologies
  • bump underfill molding RDL processes
  • OSAT partner collaboration

Nice-to-have

  • Heterogeneous Integration experience
  • FMEA control plan DOE skills
  • Customer engagement capabilities

Key Requirements

  • Bachelor degree in electronics/electrical/physics/materials engineering
  • At least 2 years working experience in OSAT R&D/Packaging/Process
  • Proficient English oral and writing skill

Work Rights

Not specified

Tailored Resume

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