(竹北)nand Flash產品工程師

winbond

竹北, Taiwan
On-site
Programming skills
Failure analysis
Cross-department collaboration
As a NAND Flash product engineer at Winbond, you will assist in analyzing failure rates and problem sources using programming languages. Your role involves conducting failure analysis, collaborating across departments for issue investigation, and maintaining engineering analysis tools. You will also be responsible for writing engineering reports and participating in technical meetings as needed

Job Summary

  • As a NAND Flash product engineer at Winbond, you will assist in analyzing failure rates and problem sources using programming languages. Your role involves conducting failure analysis, collaborating across departments for issue investigation, and maintaining engineering analysis tools. You will also be responsible for writing engineering reports and participating in technical meetings as needed.

Matching Summary

As a NAND Flash product engineer at Winbond, you will assist in analyzing failure rates and problem sources using programming languages. Your role involves conducting failure analysis, collaborating across departments for issue investigation, and maintaining engineering analysis tools. You will also be responsible for writing engineering reports and participating in technical meetings as needed.

Skills & Requirements

Must-have

  • programming skills
  • failure analysis
  • cross-department collaboration

Nice-to-have

  • experience with NAND Flash products
  • data analysis tools proficiency
  • customer complaint handling experience

Key Requirements

  • Bachelor's degree in Electrical Engineering
  • 2+ years of relevant experience
  • intermediate English proficiency

Work Rights

Not specified

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