Packaging Engineer

Analog Devices Foundation

Not specified; not specified; not specified
**
Master's degree in mechanical engineering or related field
Proficiency in solidworks or creo for mechanical design
Experience with ic packaging technologies and assembly
** Analog Devices is seeking a Packaging Engineer to collaborate on advanced IC packaging solutions within a dynamic and innovative culture. The ideal candidate should hold a Master's degree in a relevant engineering field and possess experience with packaging technologies and mechanical design software. **

Job Summary

  • The role involves designing advanced IC packages and modules while collaborating with cross-functional teams to solve complex engineering problems.
  • Candidates will support system-level structural design, perform stress evaluations, and conduct thermal simulations for various product groups.
  • Analog Devices fosters a culture focused on continuous learning, beneficial employee programs, and creating a sustainable future through innovation.

Matching Summary

Match Score: 75

** Analog Devices is seeking a Packaging Engineer to collaborate on advanced IC packaging solutions within a dynamic and innovative culture. The ideal candidate should hold a Master's degree in a relevant engineering field and possess experience with packaging technologies and mechanical design software. **

Salary

Not specified; Not specified; Not specified

Skills & Requirements

Must-have

  • Master's degree in Mechanical Engineering or related field
  • Proficiency in SolidWorks or Creo for mechanical design
  • Experience with IC packaging technologies and assembly
  • Knowledge of thermal simulation tools like Ansys Icepak
  • Understanding of IC package reliability and failure analysis

Nice-to-have

  • Experience with optical design tools such as Zemax or Lumerical
  • Familiarity with silicon photonics platforms and devices
  • Prior internship in power module or co-packaged optical assembly
  • Hands-on experience with COMSOL or Flotherm software

Key Requirements

  • Master's degree required in Mechanical Engineering, Microelectronics, or related field
  • US citizenship, permanent residency, or protected individual status required for export control compliance
  • Minimum industry experience or internship in IC package assembly preferred

Work Rights

Must have US citizenship, US Permanent Resident status, or protected individual status

Tailored Resume

Cover Letter