$180,000.00 - $247,500.00; not specified; not spec...
Hybrid
Heterogenous integration
Advanced packaging
W2w/d2w bonding
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world
Job Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.
In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
Matching Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
Salary
$180,000.00 - $247,500.00; Not specified; Not specified
Skills & Requirements
Must-have
Heterogenous Integration
Advanced Packaging
W2W/D2W bonding
micro bumps
TSV
thermal management
multi-wafer stacking
Nice-to-have
materials science and engineering
supportive work culture
personal and professional growth
structured problem-solving methodology
innovation and ideation
Key Requirements
Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
5 years of experience in advanced packaging
Experience with MES systems for Si fab processing is a plus
Ability to lead projects across organization and culture