Technical Director, Advanced Packaging Integration

Applied Materials

Singapore, Singapore
Advanced packaging process integration
Thin film deposition techniques
Electrochemical deposition (ecd)
This technical staff position leads and/or develops and executes exceptionally complex technology and engineering projects and leads research and development of new technologies as appropriate

Job Summary

  • This technical staff position leads and/or develops and executes exceptionally complex technology and engineering projects and leads research and development of new technologies as appropriate.
  • You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.
  • Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

Matching Summary

This technical staff position leads and/or develops and executes exceptionally complex technology and engineering projects and leads research and development of new technologies as appropriate.

Skills & Requirements

Must-have

  • Advanced packaging process integration
  • Thin film deposition techniques
  • Electrochemical Deposition (ECD)
  • Panel-level packaging process integration
  • Fan-out panel-level packaging (FOPLP)

Nice-to-have

  • Supportive work culture
  • Continuous improvement initiatives
  • Customer expert across broad range
  • Push boundaries of materials science

Key Requirements

  • Bachelor's degree with 15 years of experience
  • Master's degree with 10 years of experience
  • PhD degree with 5 years of experience
  • 15 years of experience in Electrical Engineering
  • 15 years of experience in Materials Science
  • 15 years of experience in Chemical Engineering

Work Rights

Not specified

Tailored Resume

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