The Senior Thermo Compression Bonding Engineer position at The Supreme HR Advisory involves engaging with semiconductor customers to optimize advanced packaging processes such as HBM and 2.5D/3D. The ideal candidate should have a strong background in semiconductor packaging with hands-on experience in TCB and related technologies
Job Summary
This role involves engaging semiconductor customers to understand packaging roadmaps and translating requirements into equipment specifications.
The engineer will develop and optimize TCB process parameters while supporting advanced applications like HBM, CoWoS, and Chiplet Integration.
Candidates must lead machine qualification activities including FAT and SAT while troubleshooting complex bonding issues such as voids and delamination.
Matching Summary
Match Score: 85
The Senior Thermo Compression Bonding Engineer position at The Supreme HR Advisory involves engaging with semiconductor customers to optimize advanced packaging processes such as HBM and 2.5D/3D. The ideal candidate should have a strong background in semiconductor packaging with hands-on experience in TCB and related technologies.
Salary
Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) experience
HBM CoWoS 2.5D 3D packaging knowledge
Flip Chip process expertise
DOE and statistical analysis skills
Troubleshooting bonding issues
Nice-to-have
Fluxless or N2 bonding environment experience
OSAT or IDM background preferred
Cross-functional team collaboration
Customer technical sales support
Machine qualification leadership
Key Requirements
Bachelor's or Master's degree in Engineering or Materials Science
5–15 years of semiconductor packaging experience
Hands-on experience with TCB and Flip Chip processes