Foveros Direct Pathfinding Integration

Intel

Hillsboro, Oregon, United States
Base: $141,910.00-269,100.00 usd; bonus/equity: st...
Hybrid
Bachelor's degree in engineering or related field
6+ years relevant experience in packaging engineering
Expertise in qualification testing and specification documentation
This role involves applying scientific principles to design and qualify packaging solutions for Intel's industry-leading innovations

Job Summary

  • This role involves applying scientific principles to design and qualify packaging solutions for Intel's industry-leading innovations.
  • The position requires managing the entire packaging development process from concepts and prototypes through to manufacturing startup and benchmarking.
  • Intel offers a competitive total compensation package including stock bonuses and comprehensive health and retirement benefits.

Matching Summary

This role involves applying scientific principles to design and qualify packaging solutions for Intel's industry-leading innovations.

Salary

Base: $141,910.00-269,100.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation programs

Skills & Requirements

Must-have

  • Bachelor's degree in engineering or related field
  • 6+ years relevant experience in packaging engineering
  • Expertise in qualification testing and specification documentation

Nice-to-have

  • Experience with advanced packaging technology development
  • Strategic supplier management skills
  • Hybrid Bonding Process development experience

Key Requirements

  • Bachelor's degree with 6+ years experience OR Master's/PhD with 4+ years
  • Experience in thermal, mechanical, and electrical design for semiconductors
  • On-site presence required in US locations

Work Rights

Not specified

Tailored Resume

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