**
Teledyne MEMS is seeking a Process Engineer/Scientist/Technologist in Edmonton to provide technical expertise in electroplating, wet processes, and wafer bonding for MEMS device production. The ideal candidate should possess a relevant engineering or science degree with at least two years of experience in the MEMS or semiconductor industry, demonstrating strong problem-solving abilities and adaptability.
**
Job Summary
The Process Engineer will provide technical engineering expertise in Electroplating, Wet process and Wafer Bonding to support all departments and will work within a team that provides stable, standard processes for optimization of current production or support of new development projects.
Your work will power innovation everywhere, from space to healthcare, shaping the future of microelectromechanical systems.
We offer opportunities for growth and skill development in a collaborative, inclusive team environment, working on technologies that impact space, healthcare, and AI.
Matching Summary
Match Score: 75
**
Teledyne MEMS is seeking a Process Engineer/Scientist/Technologist in Edmonton to provide technical expertise in electroplating, wet processes, and wafer bonding for MEMS device production. The ideal candidate should possess a relevant engineering or science degree with at least two years of experience in the MEMS or semiconductor industry, demonstrating strong problem-solving abilities and adaptability.
**
Skills & Requirements
Must-have
Electroplating technologies and processes
Wet process technologies and tools
Wafer bonding technologies and processes
Process quality metrics and control
Continuous improvement activities
Nice-to-have
Adaptable to changing needs
Creative problem solver
Thrive on making an impact
Positive work environment
Key Requirements
Minimum 2 years relevant bonding and wet processing experience
Bachelors’ degree, diploma or higher in Engineering or Science
Working knowledge of electroplating, wet process, and bonding technologies