Advanced Packaging Modeling Expert - Fea

Applied Materials

Santa Clara, CA, United States
$152,000.00 - $208,500.00 py
Onsite
Thermal-mechanical fea modeling
Advanced semiconductor packaging
Finite element analysis (fea) tools
Applied Materials is a global leader in materials engineering solutions for chip and display manufacturing

Job Summary

  • Applied Materials is a global leader in materials engineering solutions for chip and display manufacturing.
  • This role focuses on developing thermal-mechanical simulations for next-generation semiconductor packaging technologies.
  • The company offers a supportive work culture, opportunities for career growth, and a comprehensive benefits package.

Matching Summary

Applied Materials is a global leader in materials engineering solutions for chip and display manufacturing.

Salary

$152,000.00 - $208,500.00

Skills & Requirements

Must-have

  • Thermal-mechanical FEA modeling
  • Advanced semiconductor packaging
  • Finite element analysis (FEA) tools
  • Materials behavior under loads
  • Semiconductor packaging processes

Nice-to-have

  • Multi-physics simulations
  • JEDEC reliability standards
  • Scripting and automation
  • Package design tools

Key Requirements

  • M.S. or Ph.D. in Mechanical Engineering, Materials Science, Applied Physics, or related field
  • 5 years of industry experience in thermal-mechanical FEA modeling
  • Proficiency with ANSYS, Abaqus, COMSOL, or equivalent FEA tools

Work Rights

Not specified

Tailored Resume

Cover Letter