**
Teledyne Micropac is seeking a Lean Manufacturing Engineer to lead process development and optimization in a high-reliability microelectronics manufacturing environment. The ideal candidate will have significant experience in manufacturing engineering, particularly with microelectronics processes, and will utilize Lean and Six Sigma methodologies to drive continuous improvement.
**
Job Summary
Provide hands-on technical leadership to develop, optimize, and sustain high-reliability microelectronics manufacturing processes.
Apply Lean, Six Sigma, and structured problem-solving methods to eliminate waste and improve execution.
Support organization KPIs to monitor yield, rework, scrap, cycle time, and production readiness.
Matching Summary
Match Score: 75
**
Teledyne Micropac is seeking a Lean Manufacturing Engineer to lead process development and optimization in a high-reliability microelectronics manufacturing environment. The ideal candidate will have significant experience in manufacturing engineering, particularly with microelectronics processes, and will utilize Lean and Six Sigma methodologies to drive continuous improvement.
**
Skills & Requirements
Must-have
Microelectronics manufacturing processes
Process stability and yield improvement
Lean, Six Sigma, and problem-solving methods
DFM reviews and cross-functional collaboration
Process and test data analysis
New tool and automation introduction
Nice-to-have
Aerospace, defense, medical manufacturing experience
ERP/MRP systems knowledge
Continuous improvement initiatives
Key Requirements
Associate’s degree in engineering
10-15 years of manufacturing engineering experience