Advanced Packaging Td Plating Module Engineer

Intel Jobs

Hillsboro, Oregon, US
$155,520.00-219,550.00 usd; not specified; not spe...
On-site
Electroplating process development
Advanced packaging technology
Equipment metrology and system design
Intel is seeking an Advanced Packaging Td Plating Module Engineer in Hillsboro, Oregon, to lead the development of advanced packaging technology and electroplating processes. The ideal candidate should possess a Master's or PhD in a STEM discipline, with significant experience in electrochemical plating processing and advanced packaging technology

Job Summary

  • Lead the plating process development, optimize equipment solutions, material & chemical selection, and perform feasibility studies to meet device specifications.
  • Drive technology development and enablement for current and future nodes for electroplating needs, including material selection, parameter optimization, and equipment metrology.
  • We offer a total compensation package that ranks among the best in the industry, consisting of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Matching Summary

Match Score: 85

Intel is seeking an Advanced Packaging Td Plating Module Engineer in Hillsboro, Oregon, to lead the development of advanced packaging technology and electroplating processes. The ideal candidate should possess a Master's or PhD in a STEM discipline, with significant experience in electrochemical plating processing and advanced packaging technology.

Salary

$155,520.00-219,550.00 USD; Not specified; Not specified

Skills & Requirements

Must-have

  • Electroplating process development
  • Advanced packaging technology
  • Equipment metrology and system design
  • Material and chemical selection
  • Process development methodology

Nice-to-have

  • Innovative process development
  • Cross-functional team collaboration
  • Supplier engagement and collaboration
  • Continuous process improvements
  • Technical leadership and problem-solving

Key Requirements

  • Master’s degree with 6+ years experience or PhD with 4+ years experience
  • 3+ years experience in Electrochemical Plating
  • 3+ years experience in fab process development
  • 3+ years experience in advanced packaging technology
  • Advanced knowledge in statistical process control
  • Advanced knowledge in research and development
  • Advanced knowledge in manufacturing process improvement

Work Rights

Not specified

Tailored Resume

Cover Letter