Package Mechanical Design Engineer

Cisco UK

San Jose, CA, US
Base: $165,000 - $241,400 (varies by location); bo...
Fully remote
Thermomechanical simulation of semiconductor packages
Solder joint reliability analysis and fatigue modeling
Advanced finite element analysis (fea) with abaqus or ansys
Join the Cisco Silicon One team to develop unified silicon architecture for web scale networks while driving design decisions through advanced simulation

Job Summary

  • Join the Cisco Silicon One team to develop unified silicon architecture for web scale networks while driving design decisions through advanced simulation.
  • Perform critical finite element analysis to evaluate thermomechanical reliability, stress, warpage, and interconnect integrity for high-performance systems.
  • Cisco offers a competitive salary range up to $277,600 in specific locations along with comprehensive benefits including equity grants and flexible vacation time.

Matching Summary

Join the Cisco Silicon One team to develop unified silicon architecture for web scale networks while driving design decisions through advanced simulation.

Salary

Base: $165,000 - $241,400 (varies by location); Bonus/Equity: Eligible for annual bonuses and restricted stock units; Benefits: Medical, dental, vision, 401(k), paid parental leave, and flexible vacation

Skills & Requirements

Must-have

  • Thermomechanical simulation of semiconductor packages
  • Solder joint reliability analysis and fatigue modeling
  • Advanced finite element analysis (FEA) with ABAQUS or ANSYS
  • Nonlinear material modeling including creep and viscoplasticity
  • Board-level reliability assessments and PCB-package interactions

Nice-to-have

  • Python or Fortran scripting for simulation automation
  • Experience with flip chip and 2.5D/3D packaging technologies
  • Knowledge of JEDEC and IPC reliability standards
  • Correlation of simulation results with physical test data
  • Collaboration across globally distributed teams

Key Requirements

  • Bachelor's degree plus 7 years experience OR Master's plus 4 years OR PhD plus 1 year
  • Hands-on experience in thermomechanical simulation of semiconductor packages
  • Proven expertise in solder joint reliability analysis and lifetime prediction models
  • Strong proficiency with FEA tools such as ABAQUS or ANSYS
  • Familiarity with CAD tools like Creo and GD&T principles

Work Rights

Not specified

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