Wirebond Operator

Analog Devices

Chelmsford, MA, United States
Base: $25 to $31; bonus/equity: discretionary perf...
Automated and manual wedge and ball bonding
Bond pull/shear testing and rework
Plasma and solvent cleaning technologies
Analog Devices is a global semiconductor leader bridging the physical and digital worlds to enable breakthroughs at the Intelligent Edge

Job Summary

  • Analog Devices is a global semiconductor leader bridging the physical and digital worlds to enable breakthroughs at the Intelligent Edge.
  • Responsibilities include automated and manual wedge and ball bonding, bond pull/shear testing, plasma and solvent cleaning, and in-process inspection.
  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

Matching Summary

Analog Devices is a global semiconductor leader bridging the physical and digital worlds to enable breakthroughs at the Intelligent Edge.

Salary

Base: $25 to $31; Bonus/Equity: discretionary performance-based bonus; Benefits: medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time

Skills & Requirements

Must-have

  • Automated and manual wedge and ball bonding
  • Bond pull/shear testing and rework
  • Plasma and solvent cleaning technologies
  • Work under microscope with miniaturized tools
  • In-process inspection and self-inspection
  • Handle ESD sensitive material and equipment

Nice-to-have

  • Energetic and organized team players
  • Keen awareness of safety practices
  • Familiarity with OSHA standards
  • Willing to be cross-trained

Key Requirements

  • 2-3 Years RF/DC gold wire and ribbon bonding experience
  • High school diploma/GED required
  • US Citizenship required for security clearance
  • Ability to follow written and verbal instructions

Work Rights

US Citizenship required for security clearance

Tailored Resume

Cover Letter