Wire Bonding Technician

Teledyne FLIR

Base: $44,500.00-$59,300.00; bonus/equity: not spe...
Manual ball and wedge bonding experience
Automatic wire bonder setup skills
Microscope operation with hand-eye coordination
The role involves performing precise wire bonding of Focal Plane Arrays and silicon readout devices for advanced infrared sensors used in space and defense applications

Job Summary

  • The role involves performing precise wire bonding of Focal Plane Arrays and silicon readout devices for advanced infrared sensors used in space and defense applications.
  • Candidates must demonstrate the ability to work under a microscope with excellent hand-eye coordination while adhering to strict quality assurance requirements.
  • Teledyne Imaging Sensors offers a comprehensive benefits package including health insurance from day one, 401(k) matching, and educational tuition reimbursement.

Matching Summary

The role involves performing precise wire bonding of Focal Plane Arrays and silicon readout devices for advanced infrared sensors used in space and defense applications.

Salary

Base: $44,500.00-$59,300.00; Bonus/Equity: Not specified; Benefits: Health, Dental, Vision, Life Insurance, 401(k) Match, Tuition Reimbursement

Skills & Requirements

Must-have

  • Manual ball and wedge bonding experience
  • Automatic wire bonder setup skills
  • Microscope operation with hand-eye coordination
  • Electrostatic discharge (ESD) control familiarity
  • Focal Plane Array wire bonding procedures

Nice-to-have

  • Experience with ERP system data tracking
  • Mission-focused team collaboration
  • Technical excellence mindset
  • Agile work environment adaptability

Key Requirements

  • High School Diploma or Associate's degree
  • 3-5 years of wire bonding experience
  • U.S. Citizenship required

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter