$176,000.00 - $242,000.00; not specified; not spec...
Advanced semiconductor packaging
W2w / d2w bonding
Micro bumps, tsv
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world
Job Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
The successful candidate will be responsible for developing new modules leveraging Applied’s wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.
We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company.
Matching Summary
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
Salary
$176,000.00 - $242,000.00; Not specified; Not specified
Skills & Requirements
Must-have
Advanced Semiconductor Packaging
W2W / D2W bonding
micro bumps, TSV
thermal management, optics
multi-wafer stacking
materials, process, device physics
new materials and process development
structured problem-solving methodology
novel approaches
semiconductor packaging expert
packaging wiring improvement
reducing RC delays
increasing wiring density
polymer dielectrics
deposited thin film dielectrics
engineering plans, design DOEs
characterize and create engineering reports
Nice-to-have
supportive work culture
learn, develop, and grow career
drive innovative solutions
push the boundaries
learning every day
supportive leading global company
care for you at work, at home
ethical conduct
highest level of ethical conduct
Key Requirements
BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
10 years of experience in semiconductor packaging development and manufacturing