Lead Design Engineer

BETA CAE Systems International AG

Hyderabad, India
High-speed interface design
Die-to-die interconnects
Ucie standard
We are looking for an experienced lead Analog Design Engineer to drive the design and delivery of high-speed interface IPs, with a strong emphasis on Die-to-Die (D2D) interconnects based on the UCIe standard and advanced package technologies

Job Summary

  • We are looking for an experienced lead Analog Design Engineer to drive the design and delivery of high-speed interface IPs, with a strong emphasis on Die-to-Die (D2D) interconnects based on the UCIe standard and advanced package technologies.
  • Own analog blocks for high-speed interfaces such as clocking, TX/RX front-ends, termination schemes, biasing, and equalization support circuits.
  • Participate in silicon bring-up, debug, and characterization, including correlation with simulation results.

Matching Summary

We are looking for an experienced lead Analog Design Engineer to drive the design and delivery of high-speed interface IPs, with a strong emphasis on Die-to-Die (D2D) interconnects based on the UCIe standard and advanced package technologies.

Skills & Requirements

Must-have

  • high-speed interface design
  • Die-to-Die interconnects
  • UCIe standard
  • analog/mixed-signal IC design
  • schematic design, simulation, optimization

Nice-to-have

  • mentoring junior engineers
  • package-aware design flows
  • post-silicon debug and correlation

Key Requirements

  • 5+ years of hands-on experience
  • Bachelor’s or Master’s degree in Electrical / Electronics Engineering
  • Strong experience with high-speed interface design
  • Solid understanding of UCIe standard concepts
  • Experience working with advanced packaging technologies

Work Rights

Not specified

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