Senior Wire Bonding Manufacturing / Process Development Engineer

Teledyne Technologies Incorporated

Base: $113,600.00-$151,400.00; bonus/equity: not s...
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Automated wire bonding processes
Statistical analysis and doe
Process capability and compliance
** Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to optimize and sustain automated wire bonding processes in microelectronics manufacturing. The role involves hands-on support for production readiness, continuous improvement, and compliance with quality standards. **

Job Summary

  • The role involves developing and optimizing automated wire bonding processes for microelectronics manufacturing.
  • The engineer will support production readiness and drive continuous improvement initiatives.
  • Collaboration with cross-functional teams is essential to ensure quality and reliability in manufacturing.

Matching Summary

Match Score: 75

** Teledyne Technologies is seeking a Senior Wire Bonding Manufacturing/Process Development Engineer to optimize and sustain automated wire bonding processes in microelectronics manufacturing. The role involves hands-on support for production readiness, continuous improvement, and compliance with quality standards. **

Salary

Base: $113,600.00-$151,400.00; Bonus/Equity: Not specified; Benefits: Not specified

Skills & Requirements

Must-have

  • Automated wire bonding processes
  • Statistical analysis and DOE
  • Process capability and compliance

Nice-to-have

  • Experience in aerospace and defense
  • Strong communication skills
  • Knowledge of microelectronic assembly processes

Key Requirements

  • Bachelor’s degree in related field
  • 3+ years of relevant experience
  • Strong hands-on experience with automated wire bonders

Work Rights

Must have US citizenship

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