Package Design Engineer

Teledyne e2v Semiconductors SAS

Saint‑Egrève, France
Experience in packaging design
Mastering of package design flow
Knowledge in thermal simulations
Teledyne enables many products and services used daily

Job Summary

  • Teledyne enables many products and services used daily.
  • The Package Design Engineer leads the design flow of microelectronic packages.
  • Join a company committed to innovation and work-life balance.

Matching Summary

Teledyne enables many products and services used daily.

Skills & Requirements

Must-have

  • Experience in packaging design
  • Mastering of package design flow
  • Knowledge in thermal simulations

Nice-to-have

  • Strong customer focus
  • Ability to adapt and communicate
  • Experience in imaging and assembly

Key Requirements

  • Background in microelectronics or electronics
  • First confirmed experience in packaging design
  • Good level of English and French

Work Rights

Not specified

Tailored Resume

Cover Letter