Work at the forefront of packaging technologies essential for next-generation AI devices and collaborate with substrate suppliers worldwide to drive innovation and scalability
Job Summary
Work at the forefront of packaging technologies essential for next-generation AI devices and collaborate with substrate suppliers worldwide to drive innovation and scalability.
Lead efforts to qualify new capacity at advanced packaging suppliers, ensuring timely readiness to meet growing customer demand.
Collaborate closely with on-site supplier engineering teams and the US integration team to advance substrate building block technologies and manage critical process interactions.
Matching Summary
Work at the forefront of packaging technologies essential for next-generation AI devices and collaborate with substrate suppliers worldwide to drive innovation and scalability.
Skills & Requirements
Must-have
Advanced packaging substrate technology
Supplier capacity qualification
On-site supplier engineering collaboration
Substrate lead time reduction roadmaps
Process Control System adherence
Nice-to-have
Challenging conventional approaches
Building lasting supplier partnerships
Thrive on solving complex challenges
Key Requirements
Bachelor's or Master's degree with 8+ years, or PhD with 4+ years work experience in Science or Engineering
6+ years of experience in fab back-end or substrate manufacturing process development