Qorvo International Pte. Ltd. is seeking a Senior Manager for Bump/DPS & Assembly Engineering in Singapore. The role involves leading packaging technology development projects, managing OSAT partners, and ensuring timely execution of product introductions while fostering collaboration within cross-functional teams
Job Summary
Lead and manage OSAT new technology and new product introduction, qualification, and high-volume manufacturing in a timely manner.
Utilize program management methodology to plan, execute, and monitor complex process and product development projects aligned with the corporate roadmap.
Provide best-in-class industry know-how to enable continued global leadership of Qorvo package solutions while managing on-site OSAT engineering resources.
Matching Summary
Match Score: 85
Qorvo International Pte. Ltd. is seeking a Senior Manager for Bump/DPS & Assembly Engineering in Singapore. The role involves leading packaging technology development projects, managing OSAT partners, and ensuring timely execution of product introductions while fostering collaboration within cross-functional teams.
Skills & Requirements
Must-have
10+ years semiconductor packaging experience
OSAT partner management and leadership
Bumping DPS and Assembly process knowledge
New Product Introduction qualification expertise
Cross-functional team leadership skills
Nice-to-have
Strong problem-solving in assembly engineering
Proactive attitude in fast-paced environment
Excellent communication and presentation skills
Ability to coach engineering resources
Global technology development center exposure
Key Requirements
Bachelor's or Master's degree in Mechanical or Material Science Engineering
Minimum 10 years in semiconductor packaging or assembly engineering
Proven ability to lead cross-functional teams and drive supplier performance