Senior Hardware Engineer - Soc

ZF Friedrichshafen AG

Shanghai, SH, China
On-site
Analog & digital circuit design
High speed signal circuits design
Pcb stack-up design
This position is part of the ZF ADAS & HPC business unit known internally as "Capri," planned for divestiture to Harman International, a Samsung company

Job Summary

  • This position is part of the ZF ADAS & HPC business unit known internally as "Capri," planned for divestiture to Harman International, a Samsung company.
  • Utilize engineering disciplines to develop robust design solutions, generate analyses, reports and presentations, and participate in customer/supplier reviews.
  • At ZF, you accelerate your career by working together across borders and cultures, taking advantage of global development opportunities, support and a flexible working environment.

Matching Summary

This position is part of the ZF ADAS & HPC business unit known internally as "Capri," planned for divestiture to Harman International, a Samsung company.

Skills & Requirements

Must-have

  • analog & digital circuit design
  • high speed signal circuits design
  • PCB stack-up design
  • signal Protocols like Ethernet, FlexRay, SPI, MIPI
  • circuit analysis like WCA, current draw, PI and SI
  • function safety and quality process

Nice-to-have

  • Six Sigma, DFMEA, DFM/DFA
  • customer/supplier reviews
  • international challenges
  • shape future mobility

Key Requirements

  • 3+ years of Automotive electronic engineering and design experience
  • Bachelor’s degree in electronic engineering or related field
  • Professional on design tools like Mentor Graphics Dxdesigner and Expedition
  • Experience of simulations like SIMetrix
  • Knowledge of validation specifications like Cisper, ISO

Work Rights

Not specified

Tailored Resume

Cover Letter