Technology Development Engineer (solder Resist/solder Mask, Lamination, Gold/electroless Plating)
AT&S Advanced Technologies & Solutions
Kulim, Malaysia
On-site
Solder resist/solder mask process
Lamination and exposure
Gold/electroless plating (enepig)
AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards, industrializing leading-edge technologies
Job Summary
AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards, industrializing leading-edge technologies.
Your responsibilities include SRSF TD engineering tasks, new material qualification, customer communication, and guiding technical subordinates.
We offer personal and professional growth opportunities in a Greenfield Project of a recognized MNC with a secure position and long-term career perspective.
Matching Summary
AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards, industrializing leading-edge technologies.
Skills & Requirements
Must-have
Solder Resist/Solder Mask process
Lamination and Exposure
Gold/Electroless Plating (ENEPIG)
New material qualification
Customer communication and guidance
Nice-to-have
Cross-functional team development
Fast-paced, complex environment
Open-minded team player
Sensitivity to multi-racial work environment
Key Requirements
Bachelor of Engineering
2+ years in PCB/ICS/Assembly or 7+ years in Semiconductor industry