Senior Supplier Manufacturing Engineer, Osat Assembly Manufacturing Operations
Invidia
Hsinchu, Taiwan
Hybrid
Flip chip semiconductor packaging process
2.5d packaging equipment operation
Equipment and metrology technology roadmap
NVIDIA is changing the world with its relentless focus on accelerated computing that has launched the AI revolution
Job Summary
NVIDIA is changing the world with its relentless focus on accelerated computing that has launched the AI revolution.
The Senior Supplier Manufacturing Engineer will drive new product and technology introduction into high-volume manufacturing and lead continuous improvement initiatives to enhance yield, cycle time, and product quality.
NVIDIA offers competitive salaries, a generous benefits package, and a diverse, supportive environment where everyone is inspired to do their best work every day.
Matching Summary
NVIDIA is changing the world with its relentless focus on accelerated computing that has launched the AI revolution.
Skills & Requirements
Must-have
Flip Chip semiconductor packaging process
2.5D packaging equipment operation
Equipment and metrology technology roadmap
Continuous improvement initiatives
Statistical process control and DOE
Project and OSAT management experience
Nice-to-have
PCB assembly experience
Data automation solutions
Excellent written and oral communication skills
Creative supply chain/technology solutions
Diverse and supportive work environment
Key Requirements
Master’s degree or higher in Engineering or Science
8+ years experience in Flip Chip semiconductor packaging
Familiarity with semiconductor equipment acceptance processes