Design advanced electronics thermal management solutions using heat transfer principles to optimize thermal performance
Job Summary
Design advanced electronics thermal management solutions using heat transfer principles to optimize thermal performance.
Perform electronics thermal analysis, requiring experience in heat transfer, including liquid cooled, air-cooled, two-phase flow, and refrigeration thermal solutions for Mission Systems platforms such as airborne, ground based, and naval applications.
Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company.
Matching Summary
Design advanced electronics thermal management solutions using heat transfer principles to optimize thermal performance.
Salary
Base: $108,800.00 - $163,200.00; Bonus/Equity: Annual bonuses; Benefits: Health Plan, Savings Plan, Paid Time Off, Education Assistance, Training and Development, 9/80 Work Schedule
Skills & Requirements
Must-have
electronics thermal management solutions
heat transfer principles
convection and conduction problems
design by analysis
Mission Systems platforms
Nice-to-have
intellectual curiosity
cognitive diversity
pioneering spirit
advancing state of the art
multidisciplinary trade studies
Key Requirements
Bachelor’s Degree with 5 years of experience
Master’s degree with 3 years of experience
Ph.D. with 1 years of experience
U.S Citizenship is required
Ability to obtain/maintain a DoD Secret clearance
Minimum of 5 years of expertise in design by analysis
Demonstrated application of thermal engineering principles