Capillary Underfill Technology Development Module Engineer
Intel Corporation
Kulim, Malaysia
Onsite
Develops assembly processes and equipment
Applies novel concepts for innovative solutions
Optimizes manufacturing efficiency
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies
Job Summary
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
Matching Summary
Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Skills & Requirements
Must-have
Develops assembly processes and equipment
Applies novel concepts for innovative solutions
Optimizes manufacturing efficiency
Develops process and equipment specifications
Evaluates silicon and package technologies
Ensures manufacturability of physical layout
Establishes material specifications
Nice-to-have
Continuous engagement with partner engineering groups
Fundamental understanding of failure mechanisms
Consultation concerning packaging problems
Key Requirements
Bachelor’s or Master’s degree in relevant engineering fields