(高雄)先進封裝技術製程整合工程師

winbond

Kaohsiung, Taiwan
On-site
Advanced packaging process experience
Process validation and qualification
Data analysis for process improvement
As an advanced packaging process integration engineer at Winbond, you will work on hybrid bonding combined with DRAM development

Job Summary

  • As an advanced packaging process integration engineer at Winbond, you will work on hybrid bonding combined with DRAM development.
  • You will evaluate and implement advanced packaging process equipment and establish standardized processes.
  • Your role will involve adjusting processes and analyzing data to enhance the process window.

Matching Summary

As an advanced packaging process integration engineer at Winbond, you will work on hybrid bonding combined with DRAM development.

Skills & Requirements

Must-have

  • Advanced packaging process experience
  • Process validation and qualification
  • Data analysis for process improvement

Nice-to-have

  • Experience with HBM development
  • Project management skills
  • Knowledge of thermal and stress simulation

Key Requirements

  • Master's degree in engineering or related fields
  • 3+ years of relevant experience
  • Intermediate English proficiency

Work Rights

Not specified

Tailored Resume

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