Senior Program Manager

Intel

Tokyo, Japan
Onsite
Advanced packaging technologies
Substrate suppliers worldwide
Emib-t technology deployment
Work at the forefront of packaging technologies essential for next-generation AI devices

Job Summary

  • Work at the forefront of packaging technologies essential for next-generation AI devices.
  • Collaborate with substrate suppliers worldwide to drive innovation and scalability.
  • Lead efforts to qualify new capacity at advanced packaging suppliers, ensuring timely readiness to meet growing customer demand.

Matching Summary

Work at the forefront of packaging technologies essential for next-generation AI devices.

Skills & Requirements

Must-have

  • advanced packaging technologies
  • substrate suppliers worldwide
  • EMIB-T technology deployment
  • qualify new capacity
  • on-site supplier engineering teams
  • optimize and improve capacity
  • reduce throughput time
  • achieve aggressive OTD targets
  • lead time reduction roadmaps
  • adherence to Process Control System
  • new factory TV/product certification
  • detailed micro-schedules for startups
  • qualification activities and ramp monitoring
  • influence strategic decision-making

Nice-to-have

  • strong technical expertise
  • solving complex challenges
  • challenge conventional approaches
  • build lasting supplier partnerships
  • situational leadership
  • stakeholder management
  • engage effectively with supplier executive management

Key Requirements

  • 8+ years of experience (Bachelor's/Master's) or 4+ years (PhD) in Science or Engineering
  • 6+ years of experience in fab back-end or substrate manufacturing process development
  • Experience in capacity management
  • Experience in lead time analysis
  • Experience in yield improvement
  • Experience qualifying /owning process tools
  • Hands-on experience in factory operations
  • Fluent business-level English communication skills

Work Rights

Not specified

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