Packaging Simulation and Modelling Manager

Taiwan Semiconductor Manufacturing Company Limited

Taipei, Taiwan
On-site
Advanced packaging stress simulation
System and packaging thermal modeling
Heterogeneous interface fracture mechanics
The role involves leading advanced packaging stress simulation and modeling to ensure product reliability

Job Summary

  • The role involves leading advanced packaging stress simulation and modeling to ensure product reliability.
  • Candidates will conduct comprehensive system and packaging thermal simulations alongside critical heterogeneous interface fracture mechanics analysis.
  • TSMC fosters a global inclusive workplace where every employee is valued and empowered to contribute to innovation.

Matching Summary

The role involves leading advanced packaging stress simulation and modeling to ensure product reliability.

Skills & Requirements

Must-have

  • Advanced packaging stress simulation
  • System and packaging thermal modeling
  • Heterogeneous interface fracture mechanics

Nice-to-have

  • Global inclusive workplace experience
  • High-performance computing domain knowledge
  • Cross-functional team leadership

Key Requirements

  • Master's degree or Ph.D. in Electronics/Electrical Engineering, Physics, Chemistry, or Materials
  • 10-15 years of total working experience
  • 5+ years of relevant experience in advanced packaging simulation domain

Work Rights

Not specified

Tailored Resume

Cover Letter