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Thales is seeking an engineering intern specializing in electronic technologies for a three-year alternance program in Toulouse, France. The role involves working on innovative electronic packaging solutions for space applications and requires knowledge of microelectronics, packaging, and PCB technologies.
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Job Summary
You will join the Hardware Electronics Competence Center Directorate in Toulouse, within the Card and Technologies Development Service.
Your missions include defining the state of the art for heterogeneous interconnection solutions for 2.5D and 3D SIP packaging and participating in the implementation of electronic packaging choices.
Thales is a global leader in high technologies, investing heavily in R&D and committed to a safer, more environmentally friendly, and inclusive world.
Matching Summary
Match Score: 75
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Thales is seeking an engineering intern specializing in electronic technologies for a three-year alternance program in Toulouse, France. The role involves working on innovative electronic packaging solutions for space applications and requires knowledge of microelectronics, packaging, and PCB technologies.
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