Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)

NANYANG TECHNOLOGICAL UNIVERSITY

Singapore, Singapore
250°c ambient temperature resistance
Internal core temperature under 55°c
Thermal simulation tools ansys solidworks
The role involves designing a compact mechanical housing capable of withstanding 250°C ambient conditions without external cooling

Job Summary

  • The role involves designing a compact mechanical housing capable of withstanding 250°C ambient conditions without external cooling.
  • Candidates must ensure internal electronics remain stable with core temperatures below 55°C during runtime using thermal shielding.
  • The position requires integrating miniaturized compute, battery, and sensor components into a custom mount for extreme environment applications.

Matching Summary

Match Score: 75

The role involves designing a compact mechanical housing capable of withstanding 250°C ambient conditions without external cooling.

Skills & Requirements

Must-have

  • 250°C ambient temperature resistance
  • Internal core temperature under 55°C
  • Thermal simulation tools ANSYS SolidWorks
  • Miniaturized component integration
  • IP65 IP67 enclosure standards

Nice-to-have

  • Fire-fighting robot platform experience
  • Harsh-environment robotic platforms knowledge
  • Fanless computing experience
  • Custom sensor casing reassembly skills

Key Requirements

  • Bachelor or Master in Mechanical Engineering
  • Experience with heat-resistant enclosure design
  • Familiarity with embedded design principles

Work Rights

Not specified

Tailored Resume

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