Engineer, Aptd Cem - Advanced Packaging Wafer Level Technology Engineering
Micron Technology
Bachelor's or advanced degree in engineering or science
Strong analytical and critical thinking skills
Experience with semiconductor industry processes
The role involves establishing and improving wafer-level process conditions including wafer thinning and backside metal interconnects to support next-node scaling
Job Summary
The role involves establishing and improving wafer-level process conditions including wafer thinning and backside metal interconnects to support next-node scaling.
Candidates will collaborate with cross-functional teams such as Package Integration, Assembly Engineering, and Front End Wafer Fab to ensure optimal manufacturing performance.
Micron is committed to sustainability, employee well-being, and fostering a culture of inclusion, collaboration, and continuous improvement.
Matching Summary
The role involves establishing and improving wafer-level process conditions including wafer thinning and backside metal interconnects to support next-node scaling.
Skills & Requirements
Must-have
Bachelor's or advanced degree in Engineering or Science
Strong analytical and critical thinking skills
Experience with semiconductor industry processes
Nice-to-have
Growth mindset with passion for continuous learning
Demonstrated leadership and track record of impact
Proficiency in Python, R, SQL for data analytics
Key Requirements
Bachelor's or advanced degree in Engineering or Science
Internship or experience in the semiconductor industry preferred