Principal Ic Package Design Engineer

Cadence

Flip-chip package design expertise
Ic-pcb co-design experience
Signal integrity and power integrity analysis
The role involves leading flip-chip package design with a strong focus on signal integrity, power integrity, and thermal constraints

Job Summary

  • The role involves leading flip-chip package design with a strong focus on signal integrity, power integrity, and thermal constraints.
  • Candidates will drive IC-package-PCB co-design to balance performance, power, cost, technology, and thermal trade-offs.
  • Cadence offers a unique culture promoting collaboration, career development, and employee well-being through the One Cadence – One Team philosophy.

Matching Summary

The role involves leading flip-chip package design with a strong focus on signal integrity, power integrity, and thermal constraints.

Skills & Requirements

Must-have

  • Flip-chip package design expertise
  • IC-PCB co-design experience
  • Signal integrity and power integrity analysis
  • Cadence Allegro tools proficiency
  • DRAM protocol knowledge DDR4/5 GDDR6 HBM

Nice-to-have

  • Cross-functional collaboration skills
  • Mentoring team members
  • Process improvement mindset
  • Proactive problem solving attitude

Key Requirements

  • 10+ years of relevant engineering experience
  • BE/BTech or MTech in Electrical/Electronics Engineering
  • Experience with DRAM protocols like DDR4/5 and HBM3/4

Work Rights

Not specified

Tailored Resume

Cover Letter