Advanced Packaging Td Plating Module Engineer

Intel Retiree Medical Plan Trust

Hillsboro, Oregon, US
Base: $155,520.00-219,550.00 usd; bonus/equity: st...
Electroplating process development
Equipment optimization and design
Material and chemical selection
Lead the plating process development, optimize equipment solutions, material & chemical selection, and perform feasibility studies to meet device specifications

Job Summary

  • Lead the plating process development, optimize equipment solutions, material & chemical selection, and perform feasibility studies to meet device specifications.
  • Drive technology development and enablement for current and future nodes for electroplating needs, including material selection, parameter optimization, and equipment metrology.
  • We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs.

Matching Summary

Lead the plating process development, optimize equipment solutions, material & chemical selection, and perform feasibility studies to meet device specifications.

Salary

Base: $155,520.00-219,550.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Electroplating process development
  • Equipment optimization and design
  • Material and chemical selection
  • Technology roadmap development
  • Cross-functional team collaboration

Nice-to-have

  • Innovative process development
  • Data analytics and statistical methods
  • Supplier engagement and collaboration
  • Continuous process improvement

Key Requirements

  • Master’s degree with 6+ years of experience or PhD with 4+ years of experience
  • 3+ years of experience in Electrochemical Plating
  • Advanced knowledge in process development methodology
  • Experience in advanced packaging, RDL-based packaging, or ultra-fine pitch solder connections

Work Rights

Not specified

Tailored Resume

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