Advanced Packaging Process Support Engineer

Applied Materials

Hwaseong, KOR
Hybrid
On-site technical support
Die-to-wafer bonding technologies
Advanced semiconductor packaging
You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment

Job Summary

  • You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment.
  • We are looking for an experienced Process Support Engineer (PSE) to support Applied Materials KINEX bonding equipment in advanced semiconductor packaging environments.
  • You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.

Matching Summary

You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment.

Skills & Requirements

Must-have

  • on-site technical support
  • die-to-wafer bonding technologies
  • advanced semiconductor packaging
  • process engineering experiments
  • root cause analysis

Nice-to-have

  • supportive work culture
  • continuous process improvements
  • customer-facing role
  • structured problem solving

Key Requirements

  • Bachelor’s degree in Materials Science, Chemistry, Electrical/Electronics Engineering, Semiconductor Engineering, or related field
  • 5–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging
  • Willingness to work night shifts and rotational schedules

Work Rights

Not specified

Tailored Resume

Cover Letter