Test Module Development Engineer

Intel

Phoenix, Arizona, United States
Base: $133,800.00-188,890.00 usd; bonus/equity: st...
Onsite
Bachelor's degree in engineering or related stem field
6+ years of electrical test-related experience
Application of statistical controls and doe methodologies
This role executes test technology development and enablement for high-mix, low-volume testing within Intel's Advanced Packaging Technology group

Job Summary

  • This role executes test technology development and enablement for high-mix, low-volume testing within Intel's Advanced Packaging Technology group.
  • The position involves implementing sophisticated test processes, material selection, and equipment metrology to support the Intel Foundry advanced packaging roadmap.
  • Employees receive a competitive total compensation package including stock bonuses, health benefits, retirement plans, and vacation time.

Matching Summary

This role executes test technology development and enablement for high-mix, low-volume testing within Intel's Advanced Packaging Technology group.

Salary

Base: $133,800.00-188,890.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • Bachelor's degree in engineering or related STEM field
  • 6+ years of electrical test-related experience
  • Application of statistical controls and DOE methodologies

Nice-to-have

  • Prior work with semiconductor package design
  • Project management for time-critical technical projects
  • Excellent verbal and written communication skills

Key Requirements

  • Bachelor's degree with 6+ years experience OR Master's with 4+ years OR Ph.D.
  • Experience with FMEA and/or DOE methodologies
  • Regular onsite presence required in Phoenix, Arizona

Work Rights

Not specified

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