Wafer Backside Processing Technician

Teledyne Technologies Incorporated

CA, United States
$50,600.00-$67,500.00; not specified; health, dent...
Hybrid
Wafer backside processing
Cleanroom operations
Die preparation
Performs a variety of technical tasks associated with backside wafer processing and assembly operations in a cleanroom environment

Job Summary

  • Performs a variety of technical tasks associated with backside wafer processing and assembly operations in a cleanroom environment.
  • Responsibilities include die preparation, hybridization, wicking, underfill, and wire bonding processes.
  • Offers a competitive salary and benefits package including health insurance, paid time off, and 401(k) with company match.

Matching Summary

Performs a variety of technical tasks associated with backside wafer processing and assembly operations in a cleanroom environment.

Salary

$50,600.00-$67,500.00; Not specified; Health, Dental, Vision, and Life Insurance from Day 1

Skills & Requirements

Must-have

  • Wafer backside processing
  • Cleanroom operations
  • Die preparation
  • Hybridization
  • Wicking and underfill
  • Wire bonding
  • ISO Class 6 cleanroom protocols

Nice-to-have

  • Thrive on making an impact
  • Excitement of being on a team
  • Ethical standards and integrity

Key Requirements

  • High School Diploma or equivalent
  • 1-2 years semiconductor assembly experience
  • Familiarity with chemical handling
  • Ability to read and follow travelers
  • U.S. Citizen or legal resident status

Work Rights

U.S. Citizen, U.S. national, legal permanent resident, asylee, refugee or eligible for export control license

Tailored Resume

Cover Letter