Package Design Rule Owner (dro)

Intel Corporation

Phoenix, Arizona, United States
Base: $141,910.00-269,100.00 usd; bonus/equity: st...
Hybrid
Package substrate design rule owner
Semiconductor fabrication processes
Package substrate physical design
The role involves defining and deploying design rules for package substrates from the earliest technology concept stages through product tape out

Job Summary

  • The role involves defining and deploying design rules for package substrates from the earliest technology concept stages through product tape out.
  • Candidates must possess US citizenship and the ability to obtain a TS/SCI Security Clearance with Polygraph.
  • Intel offers a competitive total compensation package including stock bonuses and comprehensive health and retirement benefits.

Matching Summary

The role involves defining and deploying design rules for package substrates from the earliest technology concept stages through product tape out.

Salary

Base: $141,910.00-269,100.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • Package Substrate Design Rule Owner
  • Semiconductor fabrication processes
  • Package substrate physical design
  • Thermo-mechanical performance analysis
  • Cross-organizational stakeholder collaboration

Nice-to-have

  • Advanced packaging architectures expertise
  • Strong analytical and problem-solving skills
  • Ability to work at various abstraction levels
  • Self-motivated individual with strong organization
  • Creative solutions for debugging issues

Key Requirements

  • US Citizenship required
  • TS/SCI Security Clearance with Polygraph
  • Bachelor's degree in STEM field
  • 6+ years experience with Bachelor's degree
  • 2+ years in semiconductor packaging technologies

Work Rights

Must have US citizenship

Tailored Resume

Cover Letter