Senior Ic Physical Failure Analysis Engineer

Invidia

Israel
Not specified (assumed hybrid due to the nature of the role and industry norms).
Dual-beam pfib operation
Sem based nanoprobing techniques
Ic delayering methods
NVIDIA is seeking a Senior IC Physical Failure Analysis Engineer in Israel to enhance their Networking IC Product Engineering team. The role involves leading physical failure analysis activities to improve yield, support product qualifications, and address customer returns using advanced techniques

Job Summary

  • NVIDIA Networking IC Product Engineering team is looking for a highly skilled IC physical failure analysis engineer to support PFA activities for yield improvement, product bring-up, customer returns, and product qualification.
  • The engineer will own the physical failure analysis part, develop work procedures and techniques, and perform PFA using in-house and external lab equipment.
  • The role involves operating dual-beam PFIB, developing workflows for various sample preparations, using SEM based nanoprobing for fault isolation, and continuously driving improvements while collaborating with vendors.

Matching Summary

Match Score: 85

NVIDIA is seeking a Senior IC Physical Failure Analysis Engineer in Israel to enhance their Networking IC Product Engineering team. The role involves leading physical failure analysis activities to improve yield, support product qualifications, and address customer returns using advanced techniques.

Skills & Requirements

Must-have

  • Dual-beam PFIB operation
  • SEM based nanoprobing techniques
  • IC delayering methods
  • Fault isolation and device characterization
  • Sample preparation for TEM and optical fault isolation
  • Nanoprobing method development and execution

Nice-to-have

  • Understanding of VLSI circuit design
  • Knowledge of device physics
  • Experience with IC process engineering
  • Collaboration with vendors on new techniques
  • Self-motivated and independent learner
  • Good documentation and communication skills

Key Requirements

  • BSc in Materials, Chemical Engineering, Physics, or Chemistry
  • 5+ years relevant industry experience in IC package or die level Failure Analysis
  • Ability to work independently and in a team

Work Rights

Not specified

Tailored Resume

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