Wafer Bond Process Development Engineer

Micron Technology

Boise, ID, United States
Wafer bonding experience
Process engineering solutions
Collaborating with equipment teams
Micron Technology is a world leader in innovating memory and storage solutions

Job Summary

  • Micron Technology is a world leader in innovating memory and storage solutions.
  • You will be responsible for developing process technology for wafer bonding performance.
  • Micron offers a robust paid time-off program and paid holidays.

Matching Summary

Micron Technology is a world leader in innovating memory and storage solutions.

Skills & Requirements

Must-have

  • wafer bonding experience
  • process engineering solutions
  • collaborating with equipment teams

Nice-to-have

  • strong leadership skills
  • teamwork skills
  • ability to organize multifunctional teams

Key Requirements

  • Bachelor of Science + 3yrs experience
  • hands-on experience with wafer bonding
  • Master of Science / PhD in related fields

Work Rights

Not specified

Tailored Resume

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