Semiconductor Packaging Engineering Phd Intern

Intel Corporation

Phoenix, Arizona, United States
Base: $99,700.00-134,800.00 usd annual range; bonu...
Phd in mechanical engineering or materials science
Molecular dynamics field research experience
Ai/ml techniques for engineering applications
Join Intel as a Manufacturing Engineering Graduate Intern to optimize engineering processes and enhance factory operations

Job Summary

  • Join Intel as a Manufacturing Engineering Graduate Intern to optimize engineering processes and enhance factory operations.
  • Develop and validate finite element analysis models to simulate thermal and mechanical behavior of semiconductor packages.
  • Intel offers a total rewards package including competitive pay, stock bonuses, and comprehensive health and retirement benefits.

Matching Summary

Join Intel as a Manufacturing Engineering Graduate Intern to optimize engineering processes and enhance factory operations.

Salary

Base: $99,700.00-134,800.00 USD annual range; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation programs

Skills & Requirements

Must-have

  • PhD in Mechanical Engineering or Materials Science
  • Molecular Dynamics field research experience
  • AI/ML techniques for engineering applications
  • LAMMPS Gromacs NAMD or OpenMM software
  • CFD/FEM software like Ansys Fluent OpenFOAM

Nice-to-have

  • Design of Experiments DOE principles
  • Excellent communication and collaboration skills
  • Experience with semiconductor packaging simulations

Key Requirements

  • Pursuing PhD in Mechanical Engineering Chemical Engineering or Materials Science
  • 4+ years experience with AI/ML techniques for engineering
  • 4+ years active research in Molecular Dynamics field
  • 4+ years experience modeling Molecular Dynamics in nanoconfined spaces
  • 4+ years experience modeling large scale two phase flows

Work Rights

Not specified

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