Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI)
Job Summary
Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.
Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.
Matching Summary
Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
Skills & Requirements
Must-have
FOL Process Engineering organization leadership
stable yield and high equipment capability
continuous improvement and process governance
strategic process ownership for FOL Package Group
engineering responses to yield losses and complaints
audit readiness and cross-functional alignment
Nice-to-have
develop technical talent
balance engineering workload
disruptive innovations
Key Requirements
Bachelor’s degree in Engineering
8+ years in semiconductor assembly
proven leadership in high-mix, high-complexity FOL operations
Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan