Job Responsibilities: To lead and oversee the stability, efficiency, and compliance of various chemical stages, balance precise chemical engineering with high-volume production demands, ensuring our boards meet rigorous quality standards while maintaining a safe and sustainable shop floor. Process Control & Optimization: Manage and monitor chemical bath parameters (pH, concentration, temperature, and dwell times) for processes including: Desmear and Electroless/Electrolytic Plating. Inner/Outer layer etching. Solder mask application and development. Surface finishes Yield Improvement: Analyze defects (e.g., plating voids, over-etching, or adhesion failure) and implement root-cause corrective actions to minimize scrap rates. Lab Management: Oversee the chemical laboratory, ensuring accurate titration, Hull Cell testing, and AA (Atomic Absorption) spectroscopy analysis. Regulatory & Safety Compliance: Ensure all chemical handling and disposal meet local environmental regulations and OSHA standards. New Product Introduction (NPI): Partner with the NPI team to define process windows for new high-density interconnects (HDI) or high-frequency designs. Responsibilities with respect to significant aspects related link to operational control [*] in work area. To carry out other tasks assigned by the superior. Job Requirements: Minimum Bachelor’s Degree in Chemical Engineering, Chemistry, or Materials Science. Minimum 5 years of related experience in manufacturing field is preferred Relevant working knowledge and technical competence in the PCB manufacturing processes trends would be an added advantage. Proficiency in APQP, PPAP, FMEA, SPC, MSA Possess strong leadership and interpersonal skills and ability to drive key initiatives in line with organizational.